The Odisha government has signed an MoU with Intel Corporation and 3DGS, USA, to establish an advanced packaging glass core substrate manufacturing unit. Proposed to be located between Bhubaneswar and Khordha, this project is one of India's largest high-tech manufacturing investments. Signed in the presence of Union Minister Ashwini Vaishnaw and CM Mohan Charan Majhi, the initiative aligns with the India Semiconductor Mission. The project will be implemented in phases over 5-6 years, creating significant high-skilled employment and positioning Odisha as an emerging semiconductor hub. https://odishasambad.in/mou-signed-between-odisha-government-intel-and-3-dgs-to-bring-substrate-manufacturing-technology-to-india/ #creator program