The Odisha government has signed an MoU with Intel Corporation and US-based 3DGS to set up an advanced semiconductor packaging glass core substrate manufacturing unit. Proposed to be located between Bhubaneswar and Khordha, the project aims to strengthen India's semiconductor ecosystem under the India Semiconductor Mission. The facility will leverage Intel's technical expertise and is expected to generate significant high-skilled employment over the next 5-6 years, positioning Odisha as a digital infrastructure hub. https://sambad.in/state/odisha-intel-semiconductor-glass-core-substrate-unit-bhubaneswar-khurda-11888166 #creator program