The Odisha government has signed an MoU with Intel and 3D Glass Solutions to boost the semiconductor ecosystem in the state. Union Minister Ashwini Vaishnaw congratulated Odisha, stating that this partnership will strengthen India's electronics supply chain and chip packaging capabilities. A 2,000 crore investment is being made at Infovalley for India's first advanced 3D chip packaging plant, aimed at supporting AI and high-performance computing. https://sambad.in/state/ashwini-baishnabs-congratulations-to-odisha-11887193 #creator program