Odisha has signed an MoU with Intel Corporation and US-based 3D Glass Solutions to set up India's first semiconductor substrate manufacturing facility. With an investment of $3.3 billion (Rs 31,303 crore), the plant will be located in the Bhubaneswar-Khordha region. This project, under the India Semiconductor Mission, aims to produce advanced packaging glass core substrates and is expected to create over 1,800 skilled jobs within 4-5 years. Union Minister Ashwini Vaishnaw termed it as India's largest high-tech manufacturing investment.
https://sambad.in/business/odisha-advances-in-semiconductors-11888515
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