🚨 BIG AI & Semiconductor News for India 🇮🇳 Odisha has signed a $3.3 billion semiconductor project with Intel and US-based 3D Glass Solutions — a major step in strengthening India's position in the global chip ecosystem. What makes this project significant? This is not just semiconductor assembly. The facility will focus on manufacturing advanced glass-core semiconductor substrates, a critical technology used in: 🔹 Artificial Intelligence (AI) 🔹 Telecommunications 🔹 Defence Systems 🔹 High-Performance Computing (HPC) 📊 Planned Production Capacity: • 70,000 glass panels per year • 50 million assembled units annually • 13,000 advanced 3D integration modules Glass-core substrates are considered one of the next frontiers in semiconductor packaging, enabling faster data transfer, better thermal performance, and higher chip density. India is steadily moving beyond assembly and testing, advancing deeper into the semiconductor value chain with high-value manufacturing and advanced packaging technologies. The semiconductor story in India is getting more interesting every year. 🇮🇳⚡ #India #Semiconductors #AI #Intel #Odisha #MakeInIndia #ChipManufacturing #Technology #Electronics #Innovation #SemiconductorIndustry #🌐 राष्ट्रीय अपडेट #📢 ताज़ा खबर 🗞️ #🆕 ताजा अपडेट #investment #🚗🧗🏻भारत भ्रमण व सफर प्रेमी🚂⛰